IEEE EPS Seminar: Progress and future of heterogenous system integration, packaging and reliability
https://educationweek.ieee.org/wp-content/themes/movedo/images/empty/thumbnail.jpg
150
150
ieeeeduweek
https://secure.gravatar.com/avatar/cd5d0dea68aa71342bc8e4579c90502d?s=96&d=mm&r=g
Seminar overview
Heterogeneous system integration, packaging and reliability play a crucial role for the current and future development of semiconductors, quantum technologies and photonics. They are the key enabler to create new functionalities and business opportunities through the integration of different
types of cost-effective and high-performance chips, technologies and materials into a single system.
This seminar will discuss the progress and future challenges of heterogeneous integration, packaging, reliability and the potentials of creating more industry and business value.
Join us to explore the exciting opportunities that heterogeneous system integration can offer for the European ecosystem.