In this lecture, semiconductor advanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance and are grouped into 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration. Key enabling technologies such as flip chip and fan-out are briefly mentioned. The trends and challenges (opportunities) of advanced packaging are discussed. Also, in this lecture, chiplet design and heterogeneous integration packaging are defined.
IEEE-Affiliated Group Name: EPS
URL: https://resourcecenter.eps.ieee.org/education/webinars/epsvid0480
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