A major hurdle in developing next-generation systems for high-performance applications and industries that require handling large, secure data – such as System-in-Package (SiP) and System-on-Chip (SoC) – is the absence of low-latency, high-bandwidth, and high-density off-chip/chiplet/core interconnects.
IEEE-Affiliated Group Name: EPS
URL: https://resourcecenter.eps.ieee.org/education/webinars/eps_ed_web_pshp_102424
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