Recorded webinar on semiconductor packaging (60 minutes). Packaging is a critical and rapidly evolving part of the industry, full of challenges and innovations. Semiconductor leaders discussed activities, future challenges, and career opportunities in this exciting and fast-moving area of Semiconductor Packaging. The semiconductor engineer of tomorrow must excel in both design and packaging – high-performance, low-power, and space saving benefits of advanced packaging. https://bit.ly/49PDfHK
IEEE-Affiliated Group Name: IEEE Future Directions
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