Additively Manufactured Flexible Autonomous Reconfigurable Intelligent Surfaces, (RIS), “Smart” Packaging Structures and Backscattering Communication Modules up to 5G/mmW Frequencies

This webinar explores the development of additively manufactured flexible autonomous reconfigurable intelligent surfaces (RIS), & "smart" packaging structures, and backscattering communication modules operating at 5G/mmWave frequencies. By leveraging advanced additive manufacturing techniques, the research enables cost-effective, lightweight, and customizable RIS designs capable of dynamically manipulating electromagnetic waves for enhanced wireless communication and sensing.

This webinar explores the development of additively manufactured flexible autonomous reconfigurable intelligent surfaces (RIS), & “smart” packaging structures, and backscattering communication modules operating at 5G/mmWave frequencies. By leveraging advanced additive manufacturing techniques, the research enables cost-effective, lightweight, and customizable RIS designs capable of dynamically manipulating electromagnetic waves for enhanced wireless communication and sensing.

IEEE-Affiliated Group Name: MTT

URL: https://resourcecenter.mtt.ieee.org/education/webinars/mttweb1120#