Video

Numerical Field Calculation in Electrical Engineering with Open Access Finite Element Method Software Tools (video)
Numerical Field Calculation in Electrical Engineering with Open Access Finite Element Method Software Tools (video) 1141 630 ieeeeduweek

In virtually all areas of electrical engineering, it is sometimes necessary to calculate the electric and/or magnetic fields occurring in specific arrangements. This need ranges from the smallest circuit boards to huge overhead lines. Thanks to advances in numerical field calculation, there is no longer any need to rely on analytical approximation formulas. The finite element method (FEM) makes it possible to carry out highly accurate field calculations in a very short time.

IEEE-Affiliated Group Name: DEIS

URL: https://resourcecenter.deis.ieee.org/webinars/deis_web_nfceoa_021125#

How to Write a Good Paper (video)
How to Write a Good Paper (video) 1138 640 ieeeeduweek

This webinar will explain the key elements in preparing good “research reports”, including theses, internal reports and especially journal papers. The critical elements of each section of the research report will be reviewed, and content, organization, and style conventions will be discussed. The research report should be centered on a well-defined “research question”. In the Introduction, the importance of a clear gap sentence and statement of purpose will be emphasized.

IEEE-Affiliated Group Name: DEIS

URL: https://resourcecenter.deis.ieee.org/webinars/deis_ed_web_boxman_031025

Physical Phenomena and Challenges in Electrical Insulation for Airborne Applications (video)
Physical Phenomena and Challenges in Electrical Insulation for Airborne Applications (video) 1143 642 ieeeeduweek

The purpose of the talk is to give an overview of physical phenomena and challenges in electric insulation systems for airborne applications. First of all, the general context will be remembered. The embedded electric power is expected to significantly increase in future aircrafts. In order to manage this increase, while limiting the mass and volume of electric conductors, there is a need to increase the voltage.

IEEE-Affiliated Group Name: DEIS

URL: https://resourcecenter.deis.ieee.org/conferences/icd/deis_conf_icd24_rivenc_070224

IEEE SPS Podcast Series
IEEE SPS Podcast Series 1400 1400 ieeeeduweek

From your phone to your car’s navigation, digital tech starts with signal processing. IEEE Signal Processing Society’s podcast, “Our Digital Life,” helps you keep up with the rapid digital transformation, offering the latest in signal processing and emerging tech – one byte at a time.

IEEE-Affiliated Group Name: IEEE SPS

URL: https://www.youtube.com/playlist?list=PLcZOnmyqlalaUVEal_LT8XTRiUPaY6-FQ

Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection
Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection 1137 642 ieeeeduweek

The advent of 3D Heterogeneous Integration (3DHI) in advanced packaging and wafer-level IC packaging introduces significant challenges for inline defect inspection and offline failure analysis. The 3D stacking and wafer bonding processes create optically opaque structures, necessitating techniques like x-rays to penetrate multiple buried layers for defect detection.

IEEE-Affiliated Group Name: EPS

URL: https://resourcecenter.eps.ieee.org/education/webinars/epsvid1170

Process Development and Reliability Investigations for Scaling 3D Interconnects in Advanced Semiconductor Packaging
Process Development and Reliability Investigations for Scaling 3D Interconnects in Advanced Semiconductor Packaging 1144 631 ieeeeduweek

Advanced semiconductor packaging is playing a crucial role to drive system performance and functionality. With the increasing demand for emerging and growing computing needs, heterogeneous three-dimensional (3D) integration with fine-pitch, high-density interconnections, and multi-chip stacks are very promising in the future. The aggressive interconnects pitch scaling and nanoscale via interconnections make the process development and reliability more and more challenging.

IEEE-Affiliated Group Name: EPS

URL: https://resourcecenter.eps.ieee.org/education/webinars/epsvid1160

Recent Advances and Trends in Advanced Packaging
Recent Advances and Trends in Advanced Packaging 1131 631 ieeeeduweek

In this lecture, semiconductor advanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance and are grouped into 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration. Key enabling technologies such as flip chip and fan-out are briefly mentioned. The trends and challenges (opportunities) of advanced packaging are discussed. Also, in this lecture, chiplet design and heterogeneous integration packaging are defined.

IEEE-Affiliated Group Name: EPS

URL: https://resourcecenter.eps.ieee.org/education/webinars/epsvid0480

Photonics Systems for High Performance – CPO, Towards Photonics Chiplets (Video)
Photonics Systems for High Performance – CPO, Towards Photonics Chiplets (Video) 1138 637 ieeeeduweek

A major hurdle in developing next-generation systems for high-performance applications and industries that require handling large, secure data – such as System-in-Package (SiP) and System-on-Chip (SoC) – is the absence of low-latency, high-bandwidth, and high-density off-chip/chiplet/core interconnects.

IEEE-Affiliated Group Name: EPS

URL: https://resourcecenter.eps.ieee.org/education/webinars/eps_ed_web_pshp_102424

Power System Transient Stability Analysis – PSS/E and PSLF
Power System Transient Stability Analysis – PSS/E and PSLF 1920 1080 ieeeeduweek

Sixty years of computer development have allowed the capacity of power system dynamic simulation programs to advance from a few dozen buses to several tens of thousands. More importantly, advances in testing of power plant and load equipment have established strong understanding of where simulations are a reliable indicator of expected behavior, and where they must (still) be used with care.

IEEE-Affiliated Group Name: PES

URL: https://resourcecenter.ieee-pes.org/education/webinars/pes_ed_web_psse_011024

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