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Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection
Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection 1137 642 ieeeeduweek

The advent of 3D Heterogeneous Integration (3DHI) in advanced packaging and wafer-level IC packaging introduces significant challenges for inline defect inspection and offline failure analysis. The 3D stacking and wafer bonding processes create optically opaque structures, necessitating techniques like x-rays to penetrate multiple buried layers for defect detection.

IEEE-Affiliated Group Name: EPS

URL: https://resourcecenter.eps.ieee.org/education/webinars/epsvid1170

Process Development and Reliability Investigations for Scaling 3D Interconnects in Advanced Semiconductor Packaging
Process Development and Reliability Investigations for Scaling 3D Interconnects in Advanced Semiconductor Packaging 1144 631 ieeeeduweek

Advanced semiconductor packaging is playing a crucial role to drive system performance and functionality. With the increasing demand for emerging and growing computing needs, heterogeneous three-dimensional (3D) integration with fine-pitch, high-density interconnections, and multi-chip stacks are very promising in the future. The aggressive interconnects pitch scaling and nanoscale via interconnections make the process development and reliability more and more challenging.

IEEE-Affiliated Group Name: EPS

URL: https://resourcecenter.eps.ieee.org/education/webinars/epsvid1160

Recent Advances and Trends in Advanced Packaging
Recent Advances and Trends in Advanced Packaging 1131 631 ieeeeduweek

In this lecture, semiconductor advanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance and are grouped into 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration. Key enabling technologies such as flip chip and fan-out are briefly mentioned. The trends and challenges (opportunities) of advanced packaging are discussed. Also, in this lecture, chiplet design and heterogeneous integration packaging are defined.

IEEE-Affiliated Group Name: EPS

URL: https://resourcecenter.eps.ieee.org/education/webinars/epsvid0480

Photonics Systems for High Performance – CPO, Towards Photonics Chiplets (Video)
Photonics Systems for High Performance – CPO, Towards Photonics Chiplets (Video) 1138 637 ieeeeduweek

A major hurdle in developing next-generation systems for high-performance applications and industries that require handling large, secure data – such as System-in-Package (SiP) and System-on-Chip (SoC) – is the absence of low-latency, high-bandwidth, and high-density off-chip/chiplet/core interconnects.

IEEE-Affiliated Group Name: EPS

URL: https://resourcecenter.eps.ieee.org/education/webinars/eps_ed_web_pshp_102424

IEEE Leading Technical Teams
IEEE Leading Technical Teams 940 788 ieeeeduweek

Elevate your leadership skills with IEEE Leading Technical Teams, a live training program. Harness the power of collaboration, innovation, and effective communication to excel in an ever-evolving world. Registration is currently open for 2024 sessions with in-person and virtual options available.

IEEE-Affiliated Group Name: Educational Activities

URL: https://forms1.ieee.org/Leading-Technical-Teams.html?LT=LG_AD_3.2024_LM_LTT_EducationWeek

Power System Transient Stability Analysis – PSS/E and PSLF
Power System Transient Stability Analysis – PSS/E and PSLF 1920 1080 ieeeeduweek

Sixty years of computer development have allowed the capacity of power system dynamic simulation programs to advance from a few dozen buses to several tens of thousands. More importantly, advances in testing of power plant and load equipment have established strong understanding of where simulations are a reliable indicator of expected behavior, and where they must (still) be used with care.

IEEE-Affiliated Group Name: PES

URL: https://resourcecenter.ieee-pes.org/education/webinars/pes_ed_web_psse_011024

Graph Database and Graph Computing for Power System Analysis
Graph Database and Graph Computing for Power System Analysis 1920 1080 ieeeeduweek

The worldwide accelerating decarbonization of energy systems requires a rising penetration of renewable energy, distributed energy, and energy storage, making the power system ever large and more complex. To make the large, complex, and dynamic power system secure and cost-effective, accurate and fast analysis are crucial.

IEEE-Affiliated Group Name: PES

URL: https://resourcecenter.ieee-pes.org/education/webinars/pes_ed_web_gdgcpsa_011224

The Role of Small Modular Reactors in the Energy Transition
The Role of Small Modular Reactors in the Energy Transition 600 400 ieeeeduweek

There is an unprecedented need to expand the toolbox of solutions to boost the scalability of clean power and energy systems. Amidst this challenge, nuclear energy is increasingly recognized as an important player in the path toward deep decarbonization of the global energy mix, where small modular reactors (SMRs) are touted as the next big thing in the nuclear sector. This webinar provides an overview of SMR concepts currently under development and deployment.

IEEE-Affiliated Group Name: PES

URL: https://resourcecenter.ieee-pes.org/education/webinars/pes_ed_web_smr_061824

IEEE VTS Resource Center
IEEE VTS Resource Center 150 150 ieeeeduweek

The IEEE VTS Resource Center contains valuable, peer-reviewed technical content from reputable experts to enhance research or industry work or implement trainings—all of which are universally available on demand. VTS members and non-members can access the TA Resource Center, which offers a variety of keynote and panel presentations from VTS events, recordings of Distinguished Lectures, and educational video modules.

IEEE-Affiliated Group Name: VTS

URL: https://resourcecenter.vts.ieee.org/

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