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Heterogeneous Integration and Advanced Packaging for The Chiplet Era

August 6, 2025 @ 9:00 am – 10:00 am

Unlock the Future of AI Hardware with Our Next Reskill & Upskill Webinar! Join us for “Heterogeneous Integration and Advanced Packaging for The Chiplet Era,” a crucial session for anyone in the tech and semiconductor space. As Artificial Intelligence pushes the boundaries of computing, traditional chip scaling is no longer enough. The future lies in chiplets and Heterogeneous Integration (HI).

Details

Date:
August 6, 2025
Time:
9:00 am – 10:00 am
Website:
https://ieeemeetings.webex.com/webappng/sites/ieeemeetings/meeting/register/3694e579d56f40d48072f4ab59991b71?ticket=4832534b0000000776e6816bcd09dd2cf05847d3bd510b42a43a5abef0f00c3fa5267be651b21a4a&timestamp=1753386020102&RGID=rc80e4c0463766edd15bea81c2292c8bb&isAutoPopRegisterForm=false
Affiliated Group Name: Women in Engineering
Type: Live Webinar

Other

Type
Live Webinar
Affiliated Group Name
Women in Engineering
Level
Continuing and Professional Education